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Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying

✍ Scribed by H. L. Lai; J. G. Duh

Publisher
Springer US
Year
2003
Tongue
English
Weight
194 KB
Volume
32
Category
Article
ISSN
0361-5235

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At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We