✦ LIBER ✦

Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

✍ Scribed by C. M. T. Law; C. M. L. Wu; D. Q. Yu; L. Wang; J. K. L. Lai

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructure and mechanical properties

✍ C. M. L. Wu; D. Q. Yu; C. M. T. Law; L. Wang 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 787 KB

Effect of soldering and aging time on in

✍ Won Kyoung Choi; Hyuck Mo Lee 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 474 KB

Intermetallic compounds evolution betwee

✍ Yanghua Xia; Xiaoming Xie; Xiaoming Xie; Chuanyan Lu 📂 Article 📅 2006 🏛 Springer 🌐 English ⚖ 400 KB

Intermetallic growth kinetics for Sn-Ag,

✍ N. Dariavach; P. Callahan; J. Liang; R. Fournelle 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 699 KB

Investigation of microstructures and ten

✍ Fulong Zhu; Honghai Zhang; Rongfeng Guan; Sheng Liu 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 438 KB

Formation and Growth of Intermetallic Co

✍ M.S. Park; R. Arroyave 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 506 KB