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Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

✍ Scribed by N. Dariavach; P. Callahan; J. Liang; R. Fournelle

Publisher
Springer US
Year
2006
Tongue
English
Weight
699 KB
Volume
35
Category
Article
ISSN
0361-5235

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