✦ LIBER ✦

Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates

✍ Scribed by Chi-Won Hwang; Katsuaki Suganuma

Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 654 KB
Volume: 373
Category: Article
ISSN: 0921-5093
DOI: 10.1016/j.msea.2004.01.019

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