Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection
✍ Scribed by X.P. Zhang; C.B. Yu; Y.P. Zhang; S. Shrestha; L. Dorn
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 231 KB
- Volume
- 192-193
- Category
- Article
- ISSN
- 0924-0136
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✦ Synopsis
In this study, the processing performance of a lead-free Sn-Ag-Cu-Bi solder after rapid laser-beam reflowing was investigated, and the creep behaviors of the soldered joints were evaluated under different homologue temperatures from 0.68 to 0.82, with a systematical comparison to that of a Sn60Pb40 solder. The results show that after rapid laser-beam reflowing treatment the strength of the solder connections has been increased obviously and this is mainly due to grain refining effect and the Cu alloying effect; the lead-free Sn-Ag-Cu-Bi solder joints show a superior creep resistance in terms of a much lower creep rate and the elongated creep fracture lifetime over the traditional Sn-Pb solder.