✦ LIBER ✦

Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

✍ Scribed by C. M. L. Wu; D. Q. Yu; C. M. T. Law; L. Wang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructure, solderability, and growt

✍ C. M. T. Law; C. M. L. Wu; D. Q. Yu; L. Wang; J. K. L. Lai 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 242 KB

Investigation of microstructures and ten

✍ Fulong Zhu; Honghai Zhang; Rongfeng Guan; Sheng Liu 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 438 KB

Microstructure and mechanical properties

✍ Jun Shen; Yongchang Liu; Yajing Han; Houxiu Gao 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 212 KB

Properties and microstructure of Sn-9Zn

✍ Zhengxiang Xiao; Songbai Xue; Yuhua Hu; Huan Ye; Lili Gao; Hui Wang 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 547 KB

Developing a lead-free solder alloy Sn-B

✍ C. M. L. Wu; M. L. Huang; J. K. L. Lai; Y. C. Chan 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 982 KB

Creep behavior of eutectic Sn-Cu lead-fr

✍ C. M. L. Wu; M. L. Huang 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 338 KB