✦ LIBER ✦

Microstructure and mechanical properties of Lead-free Sn–Cu solder composites prepared by rapid directional solidification

✍ Scribed by Jun Shen; Yongchang Liu; Yajing Han; Houxiu Gao

Publisher: Springer US
Year: 2007
Tongue: English
Weight: 212 KB
Volume: 18
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-007-9131-x

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