𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

✍ Scribed by Edwin P. Lopez; Paul T. Vianco; Jerome A. Rejent; Carly George; Alice Kilgo


Publisher
Springer US
Year
2009
Tongue
English
Weight
743 KB
Volume
39
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


Thermal Oxidation Study on Lead-free Sol
✍ S. Wan Cho; K. Han; Y. Yi; S. J. Kang; K.-H. Yoo; K. Jeong; C.-N. Whang 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 188 KB

At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We