✦ LIBER ✦

Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders

✍ Scribed by T. Chen; I. Dutta

Publisher: Springer US
Year: 2007
Tongue: English
Weight: 595 KB
Volume: 37
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-007-0340-0

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Low-cycle fatigue behavior of Sn-Ag, Sn-

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

✍ Chaosuan Kanchanomai; Yukio Miyashita; Yoshiharu Mutoh 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 935 KB

Effect of Cu concentration on the reacti

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

✍ C. E. Ho; R. Y. Tsai; Y. L. Lin; C. R. Kao 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 625 KB

Effect of Cu concentration on morphology

Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

✍ Szu-Tsung Kao; Jenq-Gong Duh 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 894 KB

Thermal Oxidation Study on Lead-free Sol

Thermal Oxidation Study on Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

✍ S. Wan Cho; K. Han; Y. Yi; S. J. Kang; K.-H. Yoo; K. Jeong; C.-N. Whang 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 188 KB

At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We

Microstructure and Creep Deformation of

Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints

✍ Min He; Sylvester N. Ekpenuma; Viola L. Acoff 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 901 KB

The Influence of an Imposed Current on t

The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

✍ Christopher Kinney; J.W. Morris; Tae-Kyu Lee; Kuo-Chuan Liu; Jie Xue; Dave Towne 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 299 KB