✦ LIBER ✦

Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints

✍ Scribed by Min He; Sylvester N. Ekpenuma; Viola L. Acoff

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructural development of Sn-Ag-Cu

✍ Andreas R. Fix; Gabriel A. López; Ingo Brauer; Wolfgang Nüchter; Eric J. Mitteme 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 719 KB

Low-cycle fatigue behavior of Sn-Ag, Sn-

✍ Chaosuan Kanchanomai; Yukio Miyashita; Yoshiharu Mutoh 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 935 KB

Effects of Cu, Bi, and In on microstruct

✍ M. L. Huang; L. Wang 📂 Article 📅 2005 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 812 KB

Analysis of high speed shear characteris

✍ Santosh Kumar; Jae Yong Park; Jae Pil Jung 📂 Article 📅 2011 🏛 The Korean Institute of Metals and Materials 🌐 English ⚖ 904 KB

The morphology and kinetic evolution of

✍ S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 960 KB

Tensile and Fatigue Behaviors of Aged Cu

✍ Q. K. Zhang; H. F. Zou; Z. F. Zhang 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 644 KB