✦ LIBER ✦

Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu, Bi, In) solders

✍ Scribed by M. L. Huang; L. Wang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructure and Creep Deformation of

✍ Min He; Sylvester N. Ekpenuma; Viola L. Acoff 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 901 KB

Low-cycle fatigue behavior of Sn-Ag, Sn-

✍ Chaosuan Kanchanomai; Yukio Miyashita; Yoshiharu Mutoh 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 935 KB

The Effects of Solid-State Aging on the

✍ Albert T. Wu; Ming-Hsun Chen; Ciou-Nan Siao 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 297 KB

Mechanical fatigue characteristics of Sn

✍ Yoshiharu Kariya; Masahisa Otsuka 📂 Article 📅 1998 🏛 Springer US 🌐 English ⚖ 218 KB

Effects of rare earth additions on the m

✍ Jun Shen; Cuiping Wu; Shizeng Li 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 927 KB

Investigation of microstructures and ten

✍ Fulong Zhu; Honghai Zhang; Rongfeng Guan; Sheng Liu 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 438 KB