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Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

✍ Scribed by Tung-Han Chuang; Shiu-Fang Yen; Hui-Min Wu

No coin nor oath required. For personal study only.

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