✦ LIBER ✦

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

✍ Scribed by Chien-Fu Tseng; Tae-Kyu Lee; Gnyaneshwar Ramakrishna; Kuo-Chuan Liu; Jenq-Gong Duh

No coin nor oath required. For personal study only.

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