✦ LIBER ✦

Formation and resettlement of (AuxNi1−x)Sn4in solder joints of ball-grid-array packages with the Au/Ni surface finish

✍ Scribed by C. E. Ho; R. Zheng; G. L. Luo; A. H. Lin; C. R. Kao

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Interfacial reactions of Sn–Cu solder wi

✍ M.N. Islam; Y.C. Chan 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 503 KB

Inhibiting the formation of (Au1−xNix)Sn

✍ C. E. Ho; L. C. Shiau; C. R. Kao 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 739 KB