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Resistive Programmable Through-Silicon Vias for Reconfigurable 3-D Fabrics

✍ Scribed by Sacchetto, Davide; Zervas, Michael; Temiz, Yuksel; De Micheli, Giovanni; Leblebici, Yusuf

Book ID
120382393
Publisher
IEEE
Year
2012
Tongue
English
Weight
335 KB
Volume
11
Category
Article
ISSN
1536-125X

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## Abstract This article presents a full‐wave electromagnetic approach for analyzing the electrical performance of massively coupled through silicon vias (TSV). The TSVs are modeled with SiO~2~ insulation coating and are placed in the sandwiched SiO~2~‐Si‐SiO~2~ substrate. The planar guided wave is