✦ LIBER ✦

Requirement of silicon flatness for silicon direct bonding technology

✍ Scribed by Huang Qingan; Fu Xinghua; Chen Junning; Tong Qinyi

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Silicon-to-silicon direct bonding method

✍ Shimbo, M.; Furukawa, K.; Fukuda, K.; Tanzawa, K. 📂 Article 📅 1986 🏛 American Institute of Physics 🌐 English ⚖ 500 KB

Junction Passivation for Direct Silicon

✍ Joshi, S.; Pinto, A.; Huang, Y.-T.; Wise, R.; Cleavelin, R.; Seacrist, M.; Ries, 📂 Article 📅 2007 🏛 IEEE 🌐 English ⚖ 626 KB

Hydrophilicity of Silicon Wafers for Dir

✍ Kissinger, G. ;Kissinger, W. 📂 Article 📅 1991 🏛 John Wiley and Sons 🌐 English ⚖ 373 KB

Direct bonding of titanium layers on sil

✍ F. Baudin, L. Di Cioccio, V. Delaye, N. Chevalier, J. Dechamp… 📂 Article 📅 2012 🏛 Springer-Verlag 🌐 English ⚖ 714 KB

Hydrophobic direct bonding of silicon re

✍ C. Rauer, F. Rieutord, J. M. Hartmann, A.-M. Charvet… 📂 Article 📅 2013 🏛 Springer-Verlag 🌐 English ⚖ 395 KB

Multiscale mechanics modeling of direct

✍ Dhirendra V. Kubair; Daniel J. Cole; Lucio Colombi Ciacchi; S Mark Spearing 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 276 KB