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Junction Passivation for Direct Silicon Bond Hybrid Orientation Technology

✍ Scribed by Joshi, S.; Pinto, A.; Huang, Y.-T.; Wise, R.; Cleavelin, R.; Seacrist, M.; Ries, M.; Ramin, M.; Freeman, M.; Nguyen, B.; Matthews, K.; Wilks, B.; Denning, L.; Johnson, C.; Bennet, J.; Ma, M.; Lin, C.-T.; Banerjee, S.K.

Book ID: 114618838
Publisher: IEEE
Year: 2007
Tongue: English
Weight: 626 KB
Volume: 54
Category: Article
ISSN: 0018-9383
DOI: 10.1109/ted.2007.901350

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