✦ LIBER ✦

Reliability challenges for copper low-k dielectrics and copper diffusion barriers

✍ Scribed by Zs. Tökei; Y.-L. Li; G.P. Beyer

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Leakage current and paramagnetic defects

✍ Kiyoteru Kobayashi; Hisashi Yokoyama; Masato Endoh 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 427 KB

Comparison of characteristics and integr

✍ T.C. Wang; Y.L. Cheng; Y.L. Wang; T.E. Hsieh; G.J. Hwang; C.F. Chen 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 349 KB

Self-diffusion in copper at “low” temper

✍ Maier, K. 📂 Article 📅 1977 🏛 John Wiley and Sons 🌐 English ⚖ 742 KB

TaN-TiN binary alloys and superlattices

✍ H. Wang; A. Gupta; Ashutosh Tiwari; X. Zhang; J. Narayan 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 615 KB

TaN-TiN binary alloys and superlattices

✍ H. Wang; A. Gupta; Ashutosh Tiwari; X. Zhang; J. Narayan 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 36 KB

Influence of low-k dry etch chemistries

✍ D. Ernur; F. Iacopi; L. Carbonell; Herbert Struyf; K. Maex 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 848 KB