TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnections

✍ Scribed by H. Wang; A. Gupta; Ashutosh Tiwari; X. Zhang; J. Narayan

• Book ID: 107453309
• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 36 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0300-x