✦ LIBER ✦
TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology
✍ Scribed by Huseyin Kizil; Gusung Kim; Christoph Steinbrüchel; Bin Zhao
- Book ID
- 107452613
- Publisher
- Springer US
- Year
- 2001
- Tongue
- English
- Weight
- 231 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0361-5235
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