TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnects

✍ Scribed by H. Wang; A. Gupta; Ashutosh Tiwari; X. Zhang; J. Narayan

• Book ID: 107452958
• Publisher: Springer US
• Year: 2003
• Tongue: English
• Weight: 615 KB
• Volume: 32
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-003-0081-7