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Influence of low-k dry etch chemistries on the properties of copper and a Ta-based diffusion barrier

✍ Scribed by D. Ernur; F. Iacopi; L. Carbonell; Herbert Struyf; K. Maex

Publisher: Elsevier Science
Year: 2003
Tongue: English
Weight: 848 KB
Volume: 70
Category: Article
ISSN: 0167-9317
DOI: 10.1016/s0167-9317(03)00377-0

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