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Influence of the sidewall diffusion barrier on the transport properties of advanced Cu/low-k interconnects

✍ Scribed by Cyril Guedj; Jean-Frédéric Guillaumond; Lucile Arnaud; Vincent Arnal; Mohamed Aimadeddine; Gilles Reimbold; Joaquin Torres

Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
442 KB
Volume
82
Category
Article
ISSN
0167-9317

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