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The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics

✍ Scribed by J.R. Lloyd; C.E. Murray; S. Ponoth; S. Cohen; E. Liniger

Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
452 KB
Volume
46
Category
Article
ISSN
0026-2714

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