𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Processing and warpage evaluation of Package-on-Packages with various epoxy molding compounds

✍ Scribed by Jung, Dong-Myung; Kim, Min-Young; Oh, Tae-Sung

Book ID
125385176
Publisher
The Korean Institute of Metals and Materials
Year
2014
Tongue
English
Weight
506 KB
Volume
10
Category
Article
ISSN
1738-8090

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Effects of molding pressure on the warpa
Effects of molding pressure on the warpage and the viscoelasticities of HVQFN packages
✍ D. Y. Gui; L. J. Ernst; K. M. B. Jansen; D. G. Yang; L. Goumans; H. J. L. Bresse πŸ“‚ Article πŸ“… 2008 πŸ› John Wiley and Sons 🌐 English βš– 441 KB πŸ‘ 2 views

## Abstract Molding temperature, molding pressure, and time are three major parameters affecting the curing quality of molding materials. In this article, the effect of molding pressure on warpage of HVQFN packages is studied. The typical map‐chips with 65% silica particle‐filled epoxy resin are ma