Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

✍ Scribed by Ernst, L. J.; Zhang, G. Q.; Jansen, K. M. B.; Bressers, H. J. L.

• Book ID: 120318535
• Publisher: The American Society of Mechanical Engineers
• Year: 2003
• Tongue: English
• Weight: 606 KB
• Volume: 125
• Category: Article
• ISSN: 1043-7398
• DOI: 10.1115/1.1604156