Effects of die coatings, mold compounds, and test conditions on temperature cycling failures : LUU T. NGUYEN, STEVEN A. GEE, MARTIN R. JOHNSON, HERB E. GRIMM, HECTOR BERARDI and RANDY L. WALBERG. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18(1), 15 (March 1995)

• Book ID: 103288055
• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 115 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(96)84440-4