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Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging

✍ Scribed by Dong Kil Shin; Jung Ju Lee

Book ID: 114562003
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 544 KB
Volume: 21
Category: Article
ISSN: 1070-9894
DOI: 10.1109/96.730423

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