𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Accurate assessment of packaging stress effects on MEMS devices

✍ Scribed by Zhang, X.; Park, S.B.; Navarro, R.; Judy, M.W.

Book ID: 118034840
Publisher: IEEE
Year: 2006
Weight: 959 KB
Volume: 0
Category: Article
ISBN-13: 9780780395244
DOI: 10.1109/itherm.2006.1645500

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