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[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - PCB Thermal Via Optimization using Design of Experiments

✍ Scribed by Asghari, T.A.

Book ID: 115485694
Publisher: IEEE
Year: 2006
Weight: 385 KB
Volume: 0
Category: Article
ISBN-13: 9780780395244
DOI: 10.1109/itherm.2006.1645346

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