𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - A multiscale modeling of Thermoelectric Generators for conversion efficiency optimization

✍ Scribed by Siyi Zhou, ; Sammakia, Bahgat G.; White, Bruce; Borgesen, Peter

Book ID: 118738851
Publisher: IEEE
Year: 2012
Weight: 875 KB
Category: Article
ISBN: 1424495318
DOI: 10.1109/ITHERM.2012.6231533

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 13th IEEE Intersociety Confer

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Optimization and control of cooling microgrids for data centers

✍ Rongliang Zhou, ; Zhikui Wang, ; McReynolds, Alan; Bash, Cullen E.; Christian, T 📂 Article 📅 2012 🏛 IEEE ⚖ 983 KB

[IEEE 2012 13th IEEE Intersociety Confer

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Compact cooling devices based on giant electrocaloric effect dielectrics

✍ Xinyu Li, ; Haiming Gu, ; Xiaoshi Qian, ; Zhang, Qiming 📂 Article 📅 2012 🏛 IEEE ⚖ 461 KB

[IEEE 2012 13th IEEE Intersociety Confer

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Optimizing data center energy efficiency via ambient-aware IT workload scheduling

✍ Kumari, Niru; Shah, Amip; Bash, Cullen; Chen, Yuan; Zhenhua Liu, ; Wang, Zhikui; 📂 Article 📅 2012 🏛 IEEE ⚖ 476 KB

[IEEE 2012 13th IEEE Intersociety Confer

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - An efficient lid design for cooling stacked flip-chip 3D packages

✍ Sikka, Kamal; Wakil, Jamil; Toy, Hilton; Liu, Hsichang 📂 Article 📅 2012 🏛 IEEE ⚖ 417 KB

[IEEE Thermal and Thermomechanical 10th

[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - PCB Thermal Via Optimization using Design of Experiments

✍ Asghari, T.A. 📂 Article 📅 2006 🏛 IEEE ⚖ 385 KB

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Design challenges of thermal margining tools for silicon validation

✍ Mohammed, Rahima K.; Sahan, Ridvan A.; Prabhugoud, Mohanraj 📂 Article 📅 2010 🏛 IEEE ⚖ 987 KB