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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - An efficient lid design for cooling stacked flip-chip 3D packages

✍ Scribed by Sikka, Kamal; Wakil, Jamil; Toy, Hilton; Liu, Hsichang

Book ID: 115525665
Publisher: IEEE
Year: 2012
Weight: 417 KB
Category: Article
ISBN: 1424495318
DOI: 10.1109/itherm.2012.6231484

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