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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Volume 44 || Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results

✍ Scribed by Suhir, E.; Lee, Y. C.; Wong, C. P.


Book ID
111866882
Publisher
Springer US
Year
2007
Weight
152 KB
Edition
2007
Category
Article
ISBN
0387279741

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