✦ LIBER ✦
Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading. III. Material properties and package geometries
✍ Scribed by Saitoh, T.; Matsuyama, H.; Toya, M.
- Book ID
- 114562002
- Publisher
- IEEE
- Year
- 1998
- Tongue
- English
- Weight
- 348 KB
- Volume
- 21
- Category
- Article
- ISSN
- 1070-9894
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