Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

✍ Scribed by Se Young Yang; Young-Doo Jeon; Soon-Bok Lee; Kyung-Wook Paik

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 674 KB
• Volume: 46
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2005.06.007