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Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

✍ Scribed by Ardebili, H.; Ee Hua Wong, ; Pecht, M.

Book ID: 120759195
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 1008 KB
Volume: 26
Category: Article
ISSN: 1521-3331
DOI: 10.1109/TCAPT.2002.806172

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