✦ LIBER ✦
Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor
✍ Scribed by Muraki, Naoki; Matoba, Nobuhiro; Hirano, Takayuki; Yoshikawa, Masanobu; Pezzotti, Giuseppe
- Book ID
- 115365107
- Publisher
- Society for Applied Spectroscopy
- Year
- 2004
- Tongue
- English
- Weight
- 330 KB
- Volume
- 58
- Category
- Article
- ISSN
- 0003-7028
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