𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds

✍ Scribed by Shirangi, H.; Auersperg, J.; Koyuncu, M.; Walter, H.; Muller, W. H.; Michel, B.

Book ID: 126635366
Publisher: IEEE
Year: 2008
Weight: 314 KB
Category: Article
ISBN: 1424421284
DOI: 10.1109/ESIME.2008.4525009

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