𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Characterization and modeling of molding compound properties during cure

✍ Scribed by Jansen, K. M. B.; Qian, C.; Ernst, L. J.; Bohm, C.; Kessler, A.; Preu, H.; Stecher, M.

Book ID: 120295231
Publisher: IEEE
Year: 2008
Weight: 365 KB
Category: Article
ISBN: 1424421284
DOI: 10.1109/ESIME.2008.4525096

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