𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Effectively modeling the thermal behavior of trench-isolated bipolar transistors

✍ Scribed by Marano, I.; d'Alessandro, V.; Rinaldi, N.

Book ID: 120027920
Publisher: IEEE
Year: 2008
Weight: 508 KB
Category: Article
ISBN: 1424421284
DOI: 10.1109/ESIME.2008.4525060

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Multi-physics simulation and reliability analysis for RF-MEMS devices

✍ Rottenberg, X.; Czarnecki, P.; Tilmans, H. A. C.; De Raedt, W.; De Wolf, I. 📂 Article 📅 2008 🏛 IEEE ⚖ 583 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Investigation of thermal performance of various power-device packages

✍ Xuejun Fan, ; Aung, Kyaw T.; Li, X. 📂 Article 📅 2008 🏛 IEEE ⚖ 409 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Characterization and modeling of molding compound properties during cure

✍ Jansen, K. M. B.; Qian, C.; Ernst, L. J.; Bohm, C.; Kessler, A.; Preu, H.; Stech 📂 Article 📅 2008 🏛 IEEE ⚖ 365 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Efficient electrothermal simulation of power electronics for hybrid electric vehicle

✍ Dehbi, Anis; Wondrak, Wolfgang; Rudnyi, Evgenii B.; Killat, Udo; van Duijsen, Pe 📂 Article 📅 2008 🏛 IEEE ⚖ 779 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - A perturbation finite element method for modeling electrostatic MEMS without remeshing

✍ Boutaayamou, Mohamed; Sabariego, Ruth V.; Dular, Patrick 📂 Article 📅 2008 🏛 IEEE ⚖ 576 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Fluid-electrostatic-mechanical modeling of the dynamic response of RF-MEMS capacitive switches

✍ Bielen, Jeroen; Stulemeijer, Jiri; Ganjoo, Deepak; Ostergaard, Dale; Noijen, San 📂 Article 📅 2008 🏛 IEEE ⚖ 982 KB