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[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Investigation of thermal performance of various power-device packages

โœ Scribed by Xuejun Fan, ; Aung, Kyaw T.; Li, X.


Book ID
115453000
Publisher
IEEE
Year
2008
Weight
409 KB
Volume
0
Category
Article
ISBN
1424421284

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