𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - FEA study on electrical interconnects for a power QFN package

✍ Scribed by Almagro, Erwin Ian V.; Hornales, Benjie B.; Gestole, Marvin R.

Book ID: 115486337
Publisher: IEEE
Year: 2011
Weight: 909 KB
Volume: 0
Category: Article
ISBN: 1457701073
DOI: 10.1109/esime.2011.5765780

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