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[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Electromigration induced failure mechanism: Multiphysics model and correlation with experiments

โœ Scribed by Cacho, F.; Fiori, V.; Doyen, L.; Chappaz, C.; Tavernier, C.; Jaouen, H.


Book ID
121716407
Publisher
IEEE
Year
2008
Weight
684 KB
Category
Article
ISBN
1424421284

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