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The impact of moisture in mold compound preforms on the warpage of PBGA packages

✍ Scribed by T.Y Lin; B Njoman; D Crouthamel; K.H Chua; S.Y Teo; Y.Y Ma

Book ID
108210450
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
296 KB
Volume
44
Category
Article
ISSN
0026-2714

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## Abstract Molding temperature, molding pressure, and time are three major parameters affecting the curing quality of molding materials. In this article, the effect of molding pressure on warpage of HVQFN packages is studied. The typical map‐chips with 65% silica particle‐filled epoxy resin are ma