✦ LIBER ✦
Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range
✍ Scribed by W. H. Zhu; Sharry Ang; S. L. Gan
- Book ID
- 106390260
- Publisher
- Springer
- Year
- 2005
- Tongue
- English
- Weight
- 483 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0022-2461
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