✦ LIBER ✦

Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints

✍ Scribed by Yung-Chi Lin; Jenq-Gong Duh

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Morphological and Microstructural Evolut

✍ Yung-Chi Lin; Toung-Yi Shih; Shih-Kang Tien; Jenq-Gong Duh 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 598 KB

Effects of Solder Volume on Formation an

✍ H.T. Chen; C.Q. Wang; C. Yan; Y. Huang; Y.H. Tian 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 585 KB

Detailed Phase Evolution of a Phosphorou

✍ Yung-Chi Lin; Kai-Jheng Wang; Jenq-Gong Duh 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 898 KB

Microstructure of interfacial reaction l

✍ Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 388 KB

Impact crack propagation through the dua

✍ Shao-Wei Fu; Chi-Yang Yu; Tae-Kyu Lee; Kuo-Chuan Liu; Jenq-Gong Duh 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 880 KB

Characterization of ternary Ni2SnP layer

✍ Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 416 KB