Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint

✍ Scribed by Yung-Chi Lin; Toung-Yi Shih; Shih-Kang Tien; Jenq-Gong Duh

• Book ID: 107454991
• Publisher: Springer US
• Year: 2007
• Tongue: English
• Weight: 598 KB
• Volume: 36
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-007-0253-y