Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints

✍ Scribed by H.T. Chen; C.Q. Wang; C. Yan; Y. Huang; Y.H. Tian

• Book ID: 107453526
• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 585 KB
• Volume: 36
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-006-0004-5