✦ LIBER ✦
The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates
✍ Scribed by N. Duan; J. Scheer; J. Bielen; M. van Kleef
- Book ID
- 108361975
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 793 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0026-2714
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