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Oxygen diffusion in heavily antimony-, arsenic-, and boron-doped Czochralski silicon wafers

โœ Scribed by Ono, Toshiaki; Rozgonyi, George A.; Asayama, Eiichi; Horie, Hiroshi; Tsuya, Hideki; Sueoka, Koji


Book ID
120809167
Publisher
American Institute of Physics
Year
1999
Tongue
English
Weight
277 KB
Volume
74
Category
Article
ISSN
0003-6951

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Effects of high temperature rapid therma
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Oxygen precipitation (OP) behaviors in heavily arsenic-doped Czochralski silicon wafers without and with prior rapid thermal processing at 1100-1250 1C, subjected to subsequent two-step anneal of 450, 650 and 800 1C/4 h+1000 1C/16 h, have been investigated. It is found that the prior RTP at 1250 1C